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The following articles have been published in selected industry journals and magazines, and may be viewed using the links provided:

 

	DRIE from MEMS to wafer-level packaging   Solid State Technology, Dec 2007   Click here to view the article
	MEMS Applications on the Rise   OnBoard Technology, June 2006   Click here to download PDF
	DRIE etched silicon MEMS   MEMS Manufacturing Magazine, May 2006   Click here to download PDF
	Si DRIE for Through-Wafer Via Fabrication   Advanced Packaging, March 2006   Click here to view the article
	Three Paths to Volume   MEMS Manufacturing Magazine, Nov 2005   Click here to download the PDF
	Plasma Sources for High Rate Etching of SiC   Solid State Technology, May 2005   Click here to view the article