• Easy To Fill Sloped Vias for Interconnect Applications (2009)
• High Rate Etching of Through-Silicon Vias for Packaging (2008)
• DRIE ON 300mm wafers for CSP and SIP interconnects (2007)
• Developments in Si and SiO2 Etching for MEMS-based Optical Applications (2004)
• Silicon Micromachining using a High Density Plasma Source (2001)
• Etching 200mm diameter SCALPEL® masks with the ASE® process (2000)
• Advances in Deep Silicon Etch Processing for MEMS (2000)
• Defining Conditions for the Etching of Silicon in an Inductive Coupled Plasma Reactor (1999)
• The Benefits of Process Parameter Ramping During the Plasma Etching of High Aspect Ratio Silicon Structures (1998)
• Advances in High Rate Silicon and Oxide Etching using ICP (1999)
• Anisotropic Dry Silicon Etching (1997)
• Dry Silicon Etching For MEMS (1997)
• Novel Microstructuring Technologies in Silicon (1997)
• Advanced Silicon Etching using High Density Plasmas (1995)
  

• Developments in Si and SiO2 Etching for MEMS-based Optical Applications (2004)
• Advances in Deep Oxide Etch Processing for MEMS – Mask Selection (2000)
• Advances in High Rate Silicon and Oxide Etching using ICP (1999)
• On Inductively Coupled Plasma Etching and HARMST (1999)
  

• Easy to Fill Sloped Vias for Interconnect Applications (2009)
• High Rate Etching of Through-Silicon Vias for Packaging (2008)
• DRIE ON 300mm wafers for CSP and SIP interconnects (2007)
• Stable thin film encapsulation of acceleration sensors using polycrystalline silicon as sacrificial and encapsulation layer (2003)

• Plasma Sources for High Rate Etching of SiC (2005)
• Industrial Applications for Poly-Silicon-Germanium as Functional MEMS material (2004)
• Special Etch Technologies for Ge/Si Devices (2003)
• High Etch Rate Gallium Nitride Processing Using an Inductively Coupled Plasma Source (1999)
  

• Improved deposition rates and uniformity of silica-based films deposited by PECVD on 200mm substrates (2004)
  

Thin Film Heads

• High-Throughput Inductively Coupled Plasma Production Platform for Etching Air-Bearing Surfaces on GMR Read/Write Heads (1998)